(1) STACKPOLE ELECTRONICS Resistor manufacturer announces breakthrough in power resistor technology eeProductCenter's Gina Roos says: " Billed as the first "true" power surface-mount resistor device in the industry, Stackpole Electronics, Inc. has introduced a new surface-mount power resistor capable of handling up to 12 watts at 85°C. Available in 5-, 10- and 12-watt ratings, all devices are available in a 0.5 x 0.5 x 0.5-in. package size." Readers say: » "Potentially a better solution than conventional SM power resistors."
» "Cost and second sourcing topics need addressing."
» "Interesting concept."
» "This is great."
» "This is good, and should save space on a design I'm working on now."
» "12W in that small package. I'll buy 'em."
» "Good idea"
» "This looks like a good solution for redoing old through hole designs to SMT along with new RoHS requirements."
» "Something we can use."
USABILITY RANK: 1
(2) AGILENT TECHNOLOGIES Navigation sensors offer breakthrough performance for optical mice eeProductCenter's Gina Roos says: "Agilent Technologies Inc. has launched three new LED-based optical mouse sensors, each offering industry-best features for performance, power consumption and package size, according to the company. One sensor offers the lowest power consumption, which enables the longest battery life in cordless mice, while two entry-level sensors provide improved performance and tracking in the industry's smallest package for cordless and corded optical mice." Readers say: » "I can see all kinds of Gaming applications as the sensor base gets smaller. This is a wonderfull start."
» "Interesting. I wonder what mouse designs I could implement this sensor into. Obviously smaller mice."
» "Improved performance/tracking are more important than battery life."
» "Could also be used in small robots as motion sensors."
» "It would be nice if the sensor system was packaged as a systems component, which could be easily upgraded or changed if damaged. A simple thick screw with component and a serial interface at base would suffice."
» "I can think of many aplications for something like this, not just for use in a mouse"
» "Lower power requirments helpful."
» "Lower current consumption is important"
» "18 months from AA, sweet!"
» "I like the self adjusting frame rate."
» "Cool, but not exciting."
» "Impressive devices."
USABILITY RANK: 2
(3) CALIFORNIA MICROELECTRONICS ESD protection devices tout highest levels of protection eeProductCenter's Gina Roos says: "California Micro Devices has expanded its PicoGuard family of ultra-low capacitance diode arrays for electrostatic discharge (ESD) protection with the introduction of its CM1215 and CM1216 devices for digital consumer and computing applications. The company said the new devices are the industry's first low capacitance devices to offer ±15 kV of contact ESD protection, exceeding IEC61000-4-2 level 4 standards." Readers say: » "Interesting concept."
» "Should have high demand for its usefulness."
» "There exists new medical testing requirements for ESD. We are present failing at 4KV testing.
This product may be a solution but at a redesign/relaout level."
USABILITY RANK: 3
(4) TYCO ELECTRONICS RF connector touts space savings, lower cost eeProductCenter's Gina Roos says: "Tyco Electronics has unveiled a new low profile, microminiature RF interconnect that delivers both a space and cost savings in direct board-to-board connections. Traditionally, board-to-board RF connections have been achieved by using either two cable connectors or two board connectors with a third, spacer or bullet, between them. Both of these options can add significant cost and assembly time, said the company." Readers say: » "Nice for high end RF applications, good solution for medium volume applications."
» "Poor performance for cellular PA applications. Would need better overall insertion over the spectrum up to 18GHz."
» "Seems a bit cashy. Interesting concept."
» "Will be useful for more compact assemblies."
» "Worry about microphonics." USABILITY RANK: 4
(5) CYPRESS SEMICONDUCTOR Image sensor aims for digital camera quality eeProductCenter's Gina Roos says: "Cypress Semiconductor Corp. has developed its first image sensor targeting mobile devices with the introduction of its low-cost 3.0-megapixel CMOS image sensor with a 1/3-inch optical format, analog binning and a 12-bit analog-to-digital converter (ADC). Upshot: The new sensor delivers almost digital still camera quality on a 1/3-inch optical format for camera phones." Readers say: » "This is great news for MP image sensors in phones. I would love to have a 3MP capability in my phone."
» "Very good. Higher resolution is good."
» "While companies like Canon and Sony have nothing to fear in the digital camera market, this is still somewhat significant."
» "This is an evolving area with higher M-pixel ratings being pushed."
» "Homerun!"
USABILITY RANK: 6
(6) OMNIVISION 3.2 MP sensor brings high-end digital photos to mainstream handsets eeProductCenter's Gina Roos says: "Marking a new step in making high-end digital photography available to more mobile devices, OmniVision Technologies, Inc. has launched its new OV3630, a high performance 3.2-megapixel CMOS image sensor for digital still image and video/still camera products." Readers say: » "3.2 MP, nice. But, please... not another camera phone. For security reasons, you won't get into my business with it."
» "Expect further developments in this hot area."
» "More comptetiton evolves."
USABILITY RANK: 7
(7) MOLEX Molex Inc. has announced the development of its new iPass Interconnect System eeProductCenter's Gina Roos says: "The iPass System includes host board and backplane connectors as well as cable assemblies for applications including host bus adapters (HBAs), controller cards, servers, storage racks, switches, redundant array of independent discs (RAID) controllers, and Just a Bunch of Disks (JBODs) enclosures." Readers say: » "Good enabling technology for the SAS/SATA market."
» "Increasing data transfer rate is always welcomed." USABILITY RANK: 5
(8) MICRON Beefed up CMOS image sensor easily upgrades VGA camera phones to SXGA eeProductCenter's Gina Roos says: "Micron Technology, Inc. is now sampling a 1/4-inch optical format, 1.3 megapixel complementary metal oxide semiconductor (CMOS) image sensor for SXGA cameras. While most 1/4-inch based camera-phone handsets today are used with VGA resolution, said the company, the new MT9M112 CMOS image sensor brings 1.3 megapixel SXGA resolution to camera phones in the same optical format and module form factor, while maintaining image quality at a much higher resolution." Readers say: » "It's obvious why the target is camera phones: only 15 fps. Full motion HDTV (1920x1080) is available from other manufacturers. Why SXGA for a phone? Why not buy a camera? For security reasons, you won't be allowed in my place of business with that phone."
» "Higher Megapixel units will be forthcoming."
» "Cost seems a bit high?"
USABILITY RANK: 10
(9) TERADYNE Teradyne beefs up high-speed GbX connector platform eeProductCenter's Gina Roos says: "Teradyne, Inc. Connection Systems Division (TCS) has upgraded its high-speed, high-performance GbX connector platform with improved electrical performance including a significant reduction in crosstalk at high dates of 6.25 Gbits/s to greater than 10 Gbits/s. This enhanced version, dubbed the GbX E-Series, is optimized for differential architectures ý as is the standard platform ý and features crosstalk as low as 2 percent." Readers say: » "A good solution for high density high speed interconnect."
» "Evolving the backplane to improve the performance is key to next generation systems. This is great as it allows old backplanes to be upgraded as well."
» "Furthering the speed of data transfer helpful."
USABILITY RANK: 8
(10) TOSHIBA AMERICA Higher resolution 3.2MP image sensor targets camera phones eeProductCenter's Gina Roos says: "Toshiba America Electronic Components, Inc. (TAEC) has expanded its Dynastron complementary metal oxide semiconductor (CMOS) image sensor product line with the addition of a new 3.2-megapixel CMOS image sensor chip, aimed at high-end camera-enabled mobile handsets.
The new ET8E99-AS chip offers a small 2.7-micron pixel pitch with a 1/2.6-inch optical format and incorporates an analog-to-digital (A/D) converter in a non-diced wafer form." Readers say: » "Wonderful news for multi MP phone photo applications."
» "Continuing competition for more and more M-pixels!" USABILITY RANK: 9
