» Interconnect, passive and electromechanical technology is keeping pace with semiconductors on the march to "smaller is better." This elicits comments such as "cool... impressive... necessary... desirable... significant... exciting..." from many of our engineering reviewers.

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AUTHENTEC
Fingerprint sensor does double duty for cell phones
eeProductCenter's Gina Roos says: "AuthenTec's latest sensor, the AES2510, touts several key innovations including a low CPU load threshold, integrated navigation capability and the elimination of a companion-chip commonly used in existing fingerprint authentication solutions for cell phones. By providing fingerprint authentication in combination with navigation capabilities in a single chip, this new slide sensor will enable designers to simplify and pack more features into their cell phone designs while providing users with asset and data protection. In addition to performance improvements, the slide sensor meets the handset industry's pricing sweet spot of roughly $6.00 per chip in high volume production, down from $18 a few years ago. A key feature of the new fingerprint sensor is its low current consumption and low system CPU load. "
Readers say: » "Navigation and security in one package is likely to be very desirable in the targeted applications" » "Security on cell phones is not so critical at the moment. But as cell phones add more features, combined with higher level functions, security will become a more important issue for users." » "Another innovation that will promote portable/handheld devices." » "Accurate, multipurpose solution for cost sensitive security applications." » "If there truly is 'elimination of a companion-chip,'then are the algorithms supplied royalty free and in what form (source, object) and for what processors/languages?" » "This is such a cool component - I wish I had an application today. I would use it right away!" » "Absolutely necessary technology." » "Impressive technology. Price needs to come down for it to make it into more mainstream applications. Not 6 sigma, but impressive none-the-less." » "There must be a host of other security applications besides the cell phone." » "How fast or slow can you slide your finger? Does side-to-side wiggle affect the accuracy? I would think yes." » "Quite intriguing; I'll use it if it's bundled with a phone product line." » "Has good potential." » "Could this be applied to a interior door locks to permit access only to authorized personnel?" » "How well will this package stand-up to the elevated temperatures associated with most non-lead based solders?" » "Navigation capability is an important bonus" » "Great product." » "When are they going to be in phones? Great idea."
USABILITY RANK: 1

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APOGEE POWER INC.
Apogee redefines super capacitor
eeProductCenter's Gina Roos says: "Start-up Apogee Power believes its new capacitor technology can significantly extend the operating life of lithium-ion batteries in digital communications devices, and could replace aluminum electrolytic and other types of electrochemical double-layer or super capacitors in lithium-ion battery packs. Target markets are cell phones, smart phones, pagers, digital cameras, handheld GPS devices, personal data assistants and laptop computers. Offering high energy and power densities, along with a low equivalent series resistance (ESR) and a fast response time, the new Apogee capacitor is designed to supply the majority of the peak current to the battery for mobile devices. The electrochemical double-layer capacitor technology was initially developed for military applications, specifically for detonation systems of munitions. It uses a proprietary electrode system comprised of an electrically conductive ceramic oxide composed of ruthenium and tantalum that is highly conductive and corrosion resistant, along with a highly conductive acid-based electrolyte. The result is a capacitor that produces 100 times more power density than a conventional lithium-ion battery, claims the company. "
Readers say: » "Lower the price!" » "Voltage ratings? Capacitance? ESR? We want details!" » "It's not clear to me why the increased power density of the capacitor would extend the life of the litium-ion battery." » "This sounds like a very significant step forward for prolonging battery life!" » "Very useful application" » "Exciting technology breakthrough." » "Good news for the mobile devices market, but maybe not so good for lithium-ion battery suppliers" » "What is the capacitance or range?" » "Need detailed price information. From cost perspective, it may not be feasible to combine the capacitor with the battery in a system." » "Life extension of a Li-Ion battery by coupling an ultracapacitor is not a novel idea or achievement by Apogee. It was proposed and demonstrated in the early 90's. Apogee's core material, a ceramic film with ruthenium and tantalum, was not a novel material system, either. Actually, ruthenium oxide was acknowledged generally as a high cost material, which is not suitable for consumer products. This price barrier is intrinsic to raw materials cost, which is impossible to be reduced by mass production." » "Interesting claim about power density." » "Super idea !" » "Forget cell phones...get this capacitor technology into our laptops!" » "Marketing claims sound a little extravagant." » "Excellent if it proves cost-efficient." » "I am also a developer of supercapacitors and believe that their future is very bright."
USABILITY RANK: 2

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FCI
Connector delivers high-speed signals for high-resolution medical imaging
eeProductCenter's Gina Roos says: "FCI has expanded its MEG-Array connector family with the introduction of its new 528-position MEG-Array connector. Developed primarily for medical electronics designers, these high-speed, high-density, board-to-board connectors are used for critical signal processing connections in next-generation diagnostic equipment. The 512 photo diode elements create a need for a high pin-count connector while at the same time calling for a small connector design that can handle high speed transmissions. "
Readers say: » "Break out may be a problem." » "A mention of the per pin current rating would be helpful." » "This is a good connector. Wished the article would have dug more into mechanical specs like mating force, number of cycles/contact, etc." » "No information about contact resistance, lifetime, insertion force." » "Temperature and contact current ratings are need" » "Could be good for some applications - although the BGA-style does complicate (as opposed to alleviate) routing congestion in a pwb with few layers." » "Ball grid connectors are not new, but this application is." » "Competetive specs, but not unique to existing technology and performance." » "Key product for the medical imaging field." » "Great idea but too many connections for my applications." » "I saw no mention about connection reliability, or long term reliability when subjected to a typical usage environment." » "This connector could save money by reducing circuit density -- a major raw PCB cost driver. Pretty good return for $.08 per connection. And it handles high-speed transmissions without loss? Good-job FCI!" » "This is very interesting in our investigation of medical images" » "Is it, or not, controlled impedance? Hard to tell from the article." » "I am concerned that the devices can only be used 25 times before reliability numbers go through the roof." » "We have used MegArray connectors before. This is a great connector anywhere a high speed, high pincount, low stack height connector is needed."
USABILITY RANK: 3

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OPTREX AMERICA
Improved readability touted for TFT LCDs with AR surface treatment
eeProductCenter's Gina Roos says: "This new family of industrial thin-film transistor (TFT) color LCD modules features a new anti-reflective (AR) surface treatment on the front polarizer that significantly improves high-ambient-light readability and image clarity. The Optrex TFT modules available with AR surface treatment feature high luminance, wide viewing angles, rugged construction, high contrast and high front-of-screen performance. Available on Optrex's 6.5-in. VGA, 8.4-in. VGA and 12.1-in. SVGA TFT LCDs, the company's new anti-reflective surface treatment allows the LCDs to be used in a wide range of applications with varying ambient light conditions, including high brightness and outdoor environments. The new anti-reflective coating reduces the surface reflectivity of the LCD panel to approximately 0.3%, compared to the 6 to 12% reflectance offered by a typical anti-glare surface. As a result, Optrex's TFT LCD modules provide increased high-ambient-light legibility without increasing backlight power consumption and heat dissipation. "
Readers say: » "The panels themselves are the same with any advancement noticable being the film. Only by evaluating side-by-side with optional choices can you decide." » "AR coatings have not been popular due to the incremental cost of the coating. It is difficult to tell--from the sample pricing-- the incremental cost of going to AR coatings." » "The prices are still a bit high. I'd like to see some reliability numbers - MTTR MTBF etc..." » "We will purchase one of these displays to evaluate for a racing car dashboard display application." » "Impressive reflectivity figure. Are there absorbtion problems as a result?" » "Good advancement!" » "Could this be used on digital cameras? The displays on many cameras disappear in bright light." » "Anything that allows these displays to be viewed in bright(er) sunlight will be a blessing. Now, when's the 60" model coming out?" » "AR surface treatments are questionable for outdoor use."
USABILITY RANK: 5

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SHARP
Small display delivers power efficiency for mobile A/V products
eeProductCenter's Gina Roos says: "Sharp Corp. and its North American components group Sharp Microelectronics of the Americas announced the introduction of their first 3.6-inch Amorphous Silicon (A-Si) digital LCD liquid crystal display (LCD) with native landscape orientation for mobile audio/video (A/V) devices. It also supports TV video standards. To better meet the demands for displays with the capability to view video and graphics content, Sharp's ultra-thin 3.3-mm digital landscape display improves efficiency by eliminating the need to rotate the images on the screen. According to the company, mobile A/V product OEMs have had to use portrait-oriented displays designed for PDA applications, however, these displays draw higher power from the microprocessor or DSP chip to rotate the images into a landscape orientation. By offering native landscape orientation, it saves computational power that would otherwise be drawn from the processor or DSP. The new rugged and power efficient digital A-Si LCD display (LQ036Q1DA01) features LED backlighting, sunlight readability, and QVGA resolution. The dot pitch is 0.0755 x 0.2265 mm. The active area is 72.48 mm (H) x 54.36 mm (V). "
Readers say: » "This display is the first landscape format display to meet the needs of the media player market." » "Seems like another move in the right direction: Designing a display to meet a market-specific needs versus a fit-all approach." » "Exciting product" » "We will evaluate this part for use in our products" » "A-Si is the transistor drive? What color and mounting arrangement are the LEED's? Twisted nematic LCD or what?" » "At last we have a display which does not use more power than the main electronic drive package. Great contrast ratio and high brightness." » "Anything that operates better at lower power consumption is a Good Thing. But that name! "Amorphous Silicon (A-Si) digital LCD liquid crystal display (LCD) with native landscape orientation for mobile audio/video (A/V) devices." Sharp needs to get some PR input from Madison Avenue...." » "Cost is always a factor." » "Low power is the future, this is an incremental step in the right direction."
USABILITY RANK: 6

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ALPS ELECTRIC
Tact switches offer 20% size reduction
eeProductCenter's Gina Roos says: "In response to the consumer market for smaller and thinner devices, ALPS Electric has shrunk the size of its four-way tact switches by 20 percent. Offering a height of 4.0 mm, the company claims that the SKRV series switches with a center-push button is 20 percent smaller than previous ALPS products and the industry's thinnest switch. The key application for the new switch line is portable digital equipment such as portable audio products and digital cameras. Using ALPS' proprietary molding and precision processing technologies, the thickness of the plastic that forms the base of the housing has been reduced 30% from previous ALPS products, to 0.1 mm, while still retaining its strength. Each part has also been thin-wall molded to achieve an overall height of 4.0 mm. In addition, the mounting area has been reduced by 35% from ALPS' previous products to a dimension of 6.5 mm x 6.3 mm by partially layering the directional metal contacts (moving contacts) and center pushbutton contact (moving contact), which were formally positioned on a single plane. To save additional space, the shape has been made octagonal. "
Readers say: » "No reliabilty information." » "No information about contact resistance,debounce time, current handling" » "I'd like to see reliability ratings - MTTR/MTBF etc..." » "The smaller size is nice but may be a little early for market requirements." » "May not be ideal for digital cameras, since shrinking the size of the cameras accordingly will complicate flash issues." » "How small do we have to go before human hand-size evolution is required? I think we've gone far enough." » "The price looks higher." » "But what about ergonomics? My clumsy fingers are already stumbling on the existing switches, and now they're becoming smaller? At this rate of reduction I soon won't be able to see the next generation of switches, much less be able to manipulate them..." » "Portable products are becoming more commonplace. Space savings can contribute to product appeal and viability." » "Small size is needed to support small portable devices"
USABILITY RANK: 4

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CALIFORNIA MICRO DEVICES
Finer pitch CSP IPDs provide board real estate and cost savings
eeProductCenter's Gina Roos says: "Targeting next-generation wireless handset designs, California Micro Devices has shrunk the size of its integrated passive chip scale package (CSP) devices by more than 20% by moving to a 0.40-mm pad pitch from an industry-standard 0.50-mm pitch. For designers, this means a significant board space savings as well as cost savings for new designs. "
Readers say: » "Good information for alternative packaging solution." » "I would like to see some reliabiliy data on the product - plus comparison to other competing device." » "The major issue still is that application is limited to low pin count CSP products. End users don't have the capability to fabricate boards at this pitch for higher pin counts." » "It's bigger than flip chip." » "What are the initial board mount yields for new customers?" » "Bravo to CMD for offering both lead and lead-free versions! Too often DfM claims are made based on eutectic solders that fall to pieces in lead-free assemblies. This dual alloy component will, however, facilitate OEM and CEM transition from lead to lead-free end-products, saving designers and buyers alike much time and headaches." » "Seems intresting but what are recommeded pad dimensions for this .4 mm pitch? What's the spacing between two pads for adjacent pin short possibility?"
USABILITY RANK: 9

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FUJITSU COMPONENTS AMERICA, INC.
Fujitsu rolls out first copper XENPAK module for networking apps
eeProductCenter's Gina Roos says: "Enabling copper connections for 10 Gbit Ethernet links using InfiniBand 24 AWG cable and connectors, Fujitsu Components America, Inc., claims it has launched the industry's first copper XENPAK module (xMGC) that is compliant to the new 10GBASE-CX4 specification also known as IEEE 802.03ak/D4.2 for low-cost copper 10-Gigabit Ethernet. The company claims that the new electrical transceiver module reduces the cost per port in short reach rack-to-rack connections in data centers by offering a copper solution that can also support very short reach (VSR) parallel optics through a single port. Designed to interconnect networking and storage equipment up to 15 meters between racks, switches, or between switch-to-server connections, the x-MGC 10 Gbit Ethernet CX4 module is compliant to the XENPAK multi-source agreement (MSA), which introduced the use of XAUI signaling for 10 Gbit/s optical modules. "
Readers say: » "A niche that possibly has found a short term solution until higher perfomance alternatives can be produced more economically?" » "More bandwidth is ALWAYS significant." » "Nice product and price, though price point will need to continue to decline. When will 300m optical version be available?" » "Hats off to Fujitsu for putting out actual hardware to support Xaui to CX4."
USABILITY RANK: 8

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MURATA ELECTRONICS
Murata improves ceramic filters for module makers
eeProductCenter's Gina Roos says: "Developing a new high dielectric process technique with existing ceramic materials is what's keeping Murata Electronics in the filtering game as module makers require lower profile height components. The new planar high-density passive device (PHPD) technology, which enables thin-film printing on high Q (quality) factor ceramics, can be used to manufacture and combine multiple components in low-profile designs. The first new product based on Murata's PHPD technology is a 5 GHz micro-chip (bandpass) filter that offers a very low height of .4 mm and low insertion loss. Filtering technologies such as surface-acoustic-wave (SAW), dielectric ceramic and LC (inductor/capacitor) are most prevalent in the industry today. However, dielectric filtering is on the decline because of the inherently large size of the devices."
Readers say: » "Height and space are always a major concern in designing wireless products." » "Is it compatible with lead-free soldering?" » "Definitely a niche component." » "Would like more information on bandwidth and loss ranges for the technology." » "Innovative approach." » "I like the price. Should help to reduce product cost." » "Smaller is better! Two questions: At the targeted operating frequencies, have there been any accelerated or long-term studies on the silver's performance regarding dendritic growth? Given the tight tolerances and low profile, is this package any more susceptible to PCB bow and twist, or vulnerable to post assembly PCB flex? " » "This is significant because it addresses business and size constraints in its targeted applications. Like I always say: Do what it takes to lower the BOM or shrink the physical size. WLAN, UWB and RF-ID markets seem hot right now, but the competition is fierce."
USABILITY RANK: 7

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SEI ELECTRONICS
High-voltage chip resistors target medical devices
eeProductCenter's Gina Roos says: "SEI Electronics Inc. says its new high-voltage chip resistor series for medical applications outperforms its competitors in higher withstanding voltage and resistance range. The new HVC resistors can replace current solutions such as axial-leaded film and wirewound resistors in high-voltage medical applications with a smaller and surface-mountable part. SEI claims that the HVC resistors are capable of achieving exponentially higher withstanding voltage than competitive products -- three to four times better. SEI has improved resistor performance by using a proprietary fine film deposition process that enables the company to screen print longer and highly precise resistive traces on the substrate."
Readers say: » "These components may have good potential for use in ESD protection circuits as well." » "Need to address quality issues such as expected lifetimes and failure modes especially for medical usage." » "Nice to see medical electronics moving to surface mount high volume manufacturing techniques. Maybe my premiums will come down..." » "The achievable precision seems like an important step." » "Looks interesting." » "If these voltage withstand claims are true, why restrict this product to medical devices?" » "The size reduction is impressive, as-is SEI's accomplishment of reducing/eliminating whiskering (especially appreciated with the high potentials being managed)."
USABILITY RANK: 10