ST houses serial EEPROMs in tiny 2 x 3mm MLP8 packages

Ismini Scouras

eeProductCenter (03/26/2007 8:31 AM ET)

Geneva—STMicroelectronics' line of serial EEPROMs—from 2 to 64-Kbit densities and both the SPI and I²C interface series—is now available in the tiny 2 x 3mm MLP8 package.

Compared with the predecessor 4 x 5mm S08N package, ST's latest offering is helping its customers in the consumer and communications sectors save space and cost.

The ultra-thin (0.6mm), fine-pitch, dual flat 2 x 3mm Micro Leadframe Package (MLP) delivers key improvements compared to other packages, and the families offer footprint compatibility throughout the range from 2 to 64-Kbit density.

The tiny memory chips, in the M24 (I²C bus interface) and M95 (SPI bus interface) families, operate over a wide supply-voltage range, from 1.8V to 5.5V, and are specified to function for more than one million Write cycles and to retain data for more than 40 years.

They are suitable for compact consumer electronics applications, such as digital cameras, camcorders, MP3 players, remote controls and games consoles, as well as in communications products including cellphones, handsets, and Wi-Fi, Bluetooth and wireless-LAN cards.

All of the devices in the low-density MLP8 2x3 family, from 2 to 64 Kbit, are available in volume now, except for the 64-Kbit I²C variant, which will enter volume production in the second half of 2007.

Samples of all the devices are available now.

The datasheets are online at M24: click here and M95: click here.

STMicroelectronics, (781) 861-2650, www.st.com