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CAMBRIDGE, UK STMicroelectronics announced the ST32-M ICs, combining highly reliable flash and advanced ARM Cortex-M3 processing to manage SIM data for machine-to-machine cellular communications.
The growing market of M2M could account for over 200 million mobile connections by 2013, according to an August 2009 report by Beecham Research.
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The ST32-M IC family combines the advantages of advanced non-proprietary processor architecture and high-density low-power embedded-flash memory, enabling machines to connect to cellular networks and to authenticate themselves and communicate automatically.
Applications that use M2M capabilities include the European eCall road-accident alert system, planned for launch in 2010, which allows vehicles to automatically inform rescue services of the location and details of an accident.
Other M2M applications include automatic utility-meter reading; retail systems, such as replenishment monitoring for vending machines; security equipment; and asset-management systems.
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To communicate with the cellular network, the ST32-M has the same capabilities and security features as the company's existing ST32 smart-card processor, which is used in cellphone SIM cards worldwide.
The ST32-M is designed explicitly for M2M applications, with a wider temperature range (-40 to +105°C) allowing M2M equipment to function in harsh environments. The chip also supports many more data-writing cycles than the standard SIM controller, enabling continuous operation over an extended lifetime. It will also store data reliably for more than 10 years.
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The chip uses the industry-standard ARM Cortex-M3 embedded-processor core, allowing developers to benefit from the latest-generation processor technology while re-use existing ST32 software and design tools for faster time to market.
The ST32-M family is available in four variants having flash density of 256 Kbytes, 320 Kbytes, 416 Kbytes or 512 Kbytes. The integrated memory supports total data cycling of 500,000 cycles per page or 50 million cycles per sector.
ST is sampling the first ST32-M devices in Q4 2009 and mass production in the DFN8 6 x 5mm package is expected to begin in Q1 2010.
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