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Memory
On this site, product briefs and reviews tell what's new with SRAMs, DRAMs and specially-configuration Memories, as well as Fash and Non-Volatile Memory (EPROM, EEPROM and mask-programmable ROM). Coverage also includes content-addressable memory (CAMs), shift registers and FIFOs, along with devices using unusual word-widths and signaling techniques.
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MoSys tips memory chips in new silicon drive
MoSys Inc. said it will make memory chips using a novel high-speed interface for a broad range of networking and storage markets as the first of a planned family of standard parts for the company that is expanding beyond its roots as a supplier of silicon cores.
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Samsung rolls 30-nm-class DRAMs
South Korea's Samsung Electronics Co. Ltd. has rolled out the industry's first 30-nm-class DRAMs.
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NEWS - Intel, Micron take NAND lead, roll 25-nm chip
Intel Corp. and Micron Technology Inc. have regained the process technology lead in NAND flash, by rolling out the first in a family of 25-nm devices.
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Low-voltage 4-I/O MXSMIO serial flash memory operates at up to 104MHz per I/O
Macronix released the MX25U series, a 1.8V four-I/O MXSMIO (serial multi I/O) serial flash memory operating at speeds up to 104MHz for each I/O in 4-I/O mode.
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LSI adds four-core PowerPC, eDRAM to arsenal
LSI Corp. has added a new Power PC processor and fast embedded DRAM cores to its library, claiming demand for custom silicon is on the rise in its core networking and storage markets as it moves into 40nm technology and targets the transition to 10 Gbit Ethernet.
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Inphi samples first JEDEC-compatible memory buffer
High-speed analog semiconductor company, Inphi Corporation, is sampling the industry's first JEDEC-compatible memory buffer designed to create a new class of standards-based memory modules - load-reduced, dual-inline memory modules (LRDIMMs) - capable of delivering more than four times the memory capacity and nearly double the bandwidth, while reducing the overall power consumption.
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PR Newswire
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Last Updated: 06-17-2004
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