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Interconnects
Connectors for the latest designs must ensure high levels of performance for fast data transfers in smaller form factors and with cost-sensitive materials to offer the optimum solution for designers. This page is dedicated to providing the latest information on card edge connectors, D-subminiature, coax, DIN, and high speed/high density connectors, as well as insulation displacement types (IDCs), fiber optic connectors, receptacles, headers, RF connectors and terminal blocks. Coverage also includes new IC packaging (sockets), and wire-and-cable introductions.

Equalizing cable transceiver extends reach and reduces gauge of copper cables
The PHY2210 equalizing cable transceiver announced by Phyworks enables cable manufacturers to extend the reach and reduce the gauge of active copper cable assemblies supporting all standard data rates up to 10.5Gbps Read full story »

FCI QSFP+ cable assemblies pass Infiniband compliance testing
FCI announced that its QSFP+ (Quad Small Form-factor Pluggable +) direct attach copper cable assemblies successfully passed all normative compliance testing. Read full story »

High Power Card Edge connector cuts power loss
Connectors and interconnect systems specialist, FCI, has released the High Power Card Edge (HPCE) connector which is a next generation power card edge connector targeting applications demanding low power loss and high linear current density. Read full story »

2.0mm hard-metric interconnect system conforms to IEC 61076-4-101
Suyin announced the MetCon-2 series of hard-metric connectors with a 2.0mm pitch, conforming to the requirements of IEC 61076-4-101. Read full story »

Configuration tool picks best board enclosure
Designed for use in development systems and for production runs, Verotec (Eastleigh, UK) has introduced a family of 1U, 2U, 3U and 6U configurable integrated systems. Read full story »

Miniature SMT board-to-board connectors are 0.7mm high and 2.6mm wide
The miniature SlimStack SMT board-to-board connectors are what Molex claims to be the industry's smallest for mobile devices and other tight packaging applications. Read full story »

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Last Updated: 06-17-2004