Tensilica dataplane processor core tops 1GHz mark

Ismini Scouras

eeProductCenter (11/03/2009 9:56 AM ET)

Santa Clara, Calif.——Tensilica Inc. has introduced the Xtensa LX3 high-performance dataplane processor (DPU) core optimized for digital signal processing (DSP) and control in the system-on-chip (SOC) dataplane.

According to Tensilica, the Xtensa LX3 DPU offers the industry's widest range of pre-verified DSP options, including ConnX D2 DSP, a new 16-bit dual-MAC SIMD (single instruction multiple data) DSP for communications; ConnX Vectra LX DSP, an updated 16-bit quad-MAC SIMD DSP for communications (with new option for single load/store unit); HiFi 2 audio DSP, a 24-bit, dual-MAC audio processor; a 32-bit IEEE-754 compliant single-precision floating point unit; and a new 64-bit IEEE-754 compliant double precision floating point accelerator.

The base Xtensa LX3 DPU configuration can reach speeds of more than 1 GHz in 45nm process technology (45GS) with an area of 0.037 mm(2) and power of 0.015 mW/MHz. When built with the new ConnX Baseband Engine DSP (ConnX BBE), the Xtensa LX3 processor delivers more than 10 Giga-MACs-per-second performance, running at 625 MHz with a footprint of 0.93mm(2) (post place-and-route 45GS) and consuming 170 mW (including leakage).

The Xtensa LX3 DPU has been fine-tuned with optimized scripts for the latest generation of EDA tools, to deliver even better speed-power-area results than the predecessor Xtensa LX2 cores. When comparing functionally equivalent configurations of the Xtensa LX3 DPU versus the prior generation Xtensa LX2 DPU, the new Xtensa LX3 processor delivers up to 15 percent faster clock speed, up to 20 percent smaller die area and up to 15 percent less power using identical process technologies and libraries, according to the company.

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Tensilica Inc., www.tensilica.com

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